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ZXTEM322
MPPSTM Miniature Package Power Solutions 80V NPN LOW SATURATION TRANSISTOR
SUMMARY NPN --- VCEO= 80V; RSAT = 68m ; IC= 3.5A DESCRIPTION
Packaged in the new innovative 2mm x 2mm MLP (Micro Leaded Package) outline, these new 4th generation low saturation dual PNP transistors offer extremely low on state losses making them ideal for use in DC-DC circuits and various driving and power management functions. Additionally users gain several other key benefits: Performance capability equivalent to much larger packages Improved circuit efficiency & power levels PCB area and device placement savings Lower Package Height (0.9mm nom) Reduced component count
MLP322
FEATURES
* Low Equivalent On Resistance * Extremely Low Saturation Voltage (185mV max @1A) * hFE specified up to 5A * IC=-3.5A Continuous Collector Current * 2mm x 2mm MLP
APPLICATIONS
* DC - DC Converters * DC - DC Modules * Power switches * Motor control
ORDERING INFORMATION
DEVICE ZXTEM322TA ZXTEM322TC REEL SIZE 7" 13" TAPE WIDTH 8mm 8mm QUANTITY PER REEL 3000 10000
Underside View DEVICE MARKING
* SE
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ZXTEM322
ABSOLUTE MAXIMUM RATINGS
PARAMETER Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Peak Pulse Current Continuous Collector Current Base Current Power Dissipation at TA=25C (a) Linear Derating Factor Power Dissipation at TA=25C (b) Linear Derating Factor Power Dissipation at TA=25C (d) Linear Derating Factor Power Dissipation at TA=25C (e) Linear Derating Factor Operating & Storage Temperature Range Junction Temperature
(a)
SYMBOL V CBO V CEO V EBO I CM IC IB PD PD PD PD T j :T stg Tj
LIMIT 100 80 7.5 5 3.5 1000 1.5 12 2.45 19.6 1 8 3 24 -55 to +150 150
UNIT V V V A A mA W mW/ C W mW/ C W mW/ C W mW/ C C C
THERMAL RESISTANCE
PARAMETER Junction to Ambient (a) Junction to Ambient Junction to Ambient Junction to Ambient
(b) (d) (e)
SYMBOL R JA R JA R JA R JA
VALUE 83 51 125 42
UNIT C/W C/W C/W C/W
NOTES (a) For a single device surface mounted on 10 sq cm 1oz copper on FR4 PCB, in still air conditions with all exposed pads attached. (b) For a single device surface mounted on 10 sq cm 1oz copper on FR4 PCB, in still air conditions measured at t 5 secs with all exposed pads attached. (c) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph. (d) For a single device surface mounted on 10 sq cm 1oz copper FR4 PCB, in still air conditions with minimal lead connections only. (e) For a single device surface mounted on 65 sq cm 2oz copper FR4 PCB, in still air conditions with all exposed pads attached. (f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight and 1mm wide tracks is Rth= 300C/W giving a power rating of Ptot=420mW
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ZXTEM322
TYPICAL CHARACTERISTICS
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ZXTEM322
ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated)
PARAMETER Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cut-Off Current Emitter Cut-Off Current Collector Emitter Cut-Off Current Collector-Emitter Saturation Voltage SYMBOL V (BR)CBO V (BR)CEO V (BR)EBO I CBO I EBO I CES V CE(sat) 15 45 145 160 240 1.09 0.96 200 300 110 60 20 100 450 450 170 90 30 10 160 11.5 86 1128 18 MIN. 100 80 7.5 TYP. 180 110 8.2 25 25 25 20 60 185 200 325 1.175 1.05 900 MAX. UNIT CONDITIONS V V V nA nA nA mV mV mV mV mV V V I C =100 A I C =10mA* I E =100 A V CB =80V V EB =6V V CE =65V I C =0.1A, I B =10mA* I C =0.5A, I B =50mA* I C =1A, I B =20mA* I C =1.5A, I B =50mA* I C =3.5A, I B =300mA* I C =3.5A, I B =300mA* I C =3.5A, V CE =2V* I C =10mA, V CE =2V* I C =200mA, V CE =2V* I C =1A, V CE =2V* I C =1.5A, V CE =2V* I C =3A, V CE =2V* I C =5A, V CE =2V* MHz I C =50mA, V CE =10V f=100MHz pF ns ns V CB =10A, f=1MHz V CC =10V, I C =1A I B1 =I B2 =25mA
Base-Emitter Saturation Voltage Base-Emitter Turn-On Voltage Static Forward Current Transfer Ratio
V BE(sat) V BE(on) h FE
Transition Frequency Output Capacitance Turn-On Time Turn-Off Time
fT C obo t (on) t (off)
*Measured under pulsed conditions. Pulse width=300 s. Duty cycle
2%
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ZXTEM322
TYPICAL CHARACTERISTICS
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ZXTEM322
PACKAGE OUTLINE
Controlling dimensions are in millimetres. Approximate conversions are given in inches
PACKAGE DIMENSIONS
DIM A A1 A2 A3 b b1 D D2 D4 Millimetres Min 0.80 0.00 0.65 0.15 0.18 0.17 Max 1.00 0.05 0.75 0.25 0.28 0.30 Inches Min 0.0315 0.00 0.0255 0.0059 0.0070 0.0066 Max 0.0393 0.002 0.0295 0.0098 0.0110 0.0118 DIM e E E2 E4 L L2 r Millimetres Min Max Inches Min Max
0.65 REF 2.00 BSC 0.79 0.48 0.20 0.99 0.68 0.45
0.0255 REF 0.0787 BSC 0.031 0.0188 0.0078 0.039 0.0267 0.0177
0.125 MAX. 0.075 BSC 0 12
0.005 REF 0.0029 BSC 0 12
2.00 BSC 1.22 0.56 1.42 0.76
0.0787 BSC 0.0480 0.0220 0.0559 0.0299
(c) Zetex plc 2003
Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to
www.zetex.com ISSUE 1 - JUNE 2003
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